Lead frame design for chip scale package

ABSTRACT

A universal lead frame for mounting dice to form integrated circuit packages is provided. The lead frame may be made from a metal sheet, which may be stamped or etched. The lead frame provides a plurality of posts and a connecting sheet connecting the plurality of posts. Dice are adhesively mounted on to a first set of the plurality of posts. The dice are then electrically connected to a second set of the plurality of posts using wire bonding. An encapsulating material is placed over the dice and lead frame, with the connecting sheet keeping the encapsulating material on one side of the lead frame. The connecting sheet is then removed, leaving the posts as separate leads. The integrated circuits formed by the encapsulated dice and leads may be tested as a panel, before the integrated circuits are singulated.

This application is Divisional of prior application Ser No. 09/590,551,filed on Jun. 9, 2000, from which priority under 35 U.S.C. §120 isclaimed.

FIELD OF THE INVENTION

The present invention relates generally to integrated circuit packages.More specifically, the invention relates to lead frames for theproduction of chip scale integrated circuit packages.

BACKGROUND OF THE INVENTION

An integrated circuit (IC) package encapsulates an IC chip (die) in aprotective casing and may also provide power and signal distributionbetween the IC chip and an external printed circuit board (PCB). An ICpackage may use a metal lead frame to provide electrical paths for thatdistribution.

To facilitate discussion, FIG. 1 is a top view of a lead frame panel 100made up for a plurality of lead frames that may be used in the priorart. The lead frame may comprise leads 108, die attach pads 112, ties116 for supporting the die attach pads 112, and a skirt 120 forsupporting the plurality of leads 108 and ties 116. The lead frame panel100 may be etched or stamped from a thin sheet of metal. IC chips 124may be mounted to the die attach pads 112 by an adhesive epoxy. Wirebonds 128, typically of fine gold wire, may then be added toelectrically connect the IC chips 124 to the leads 108. Each IC chip 124may then be encapsulated with part of the leads 108 and the die attachpad 112 in a protective casing, which may be produced by installing apreformed plastic or ceramic housing around each IC chip or bydispensing and molding a layer of encapsulation material over all ICchips 124. FIG. 2 is a cross-sectional view of part of the lead framepanel 100 and IC chips 124. In a process described in U.S. patentapplication Ser. No. 09/054,422, entitled “Lead Frame Chip ScalePackage”, by Shahram Mostafazadeh et al., filed Apr. 2, 1998, a tape 136is placed across the bottom of the lead frame panel 100 and a dam 132 isplaced around the lead frame panel 100. An encapsulation material 140 ispoured to fill the dam 132, encapsulating the IC chips 124, the wirebonds 128, and part of the lead frame panel 100. The tape 136 preventsthe encapsulation material 140 from passing through the lead frame panel100. Once the encapsulation material 140 is hardened, the dam 132 andtape 136 may be removed. The encapsulation material 140 may be cut tosingulate the IC chips 124 and leads 108.

It is desirable to provide an IC package process, which does not requirethe steps of adding tape to the lead frame and then removing the tapefrom the lead frame. It is also desirable to provide a process and leadframe that may accommodate various chip sizes and provides lead fingers.

SUMMARY OF THE INVENTION

To achieve the foregoing and other objects and in accordance with thepurpose of the present invention, a variety of techniques is providedfor packaging of integrated circuits. Generally, a conductive substrateformed from a conductive material is patterned to define a plurality ofposts and a connecting sheet connecting the plurality of posts. Dice arephysically mounted on a first portion of the plurality of posts, whereineach die is physically mounted on at least four posts. The dice areelectrically connected to a second portion of the plurality of posts. Acap is molded over the plurality of dice and the patterned conductivesubstrate. The connecting sheet is then removed. Finally, integratedcircuit packages are singulated.

Another aspect of the invention provides another method for packagingintegrated circuits. Generally, a conductive substrate formed from aconductive material is patterned to define a plurality of posts and aconnecting sheet connecting the plurality of posts. Dice are physicallymounted on a first portion of the plurality of posts. The dice areelectrically connected to a second portion of the plurality of posts. Acap is molded over the plurality of dice and the patterned conductivesubstrate. The posts are separated to form lead fingers from theseparated plurality of posts.

These and other features of the present invention will be described inmore detail below in the detailed description of the invention and inconjunction with the following figures.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1 is a plan view of a lead frame and die assembly used in the priorart.

FIG. 2 is a cross-sectional view of part of the lead frame panelillustrated in FIG. 1.

FIG. 3 is a flow chart of a process used in a preferred embodiment ofthe invention.

FIG. 4 is a cross-sectional view of part of a metal sheet beforeprocessing.

FIG. 5 is a cross-sectional view of the part of the metal sheet after itis processed into a lead frame.

FIG. 6 is a top view of the part of the metal sheet shown in FIG. 5.

FIG. 7 is a top view of the part of the lead frame with a plurality ofdies.

FIG. 8 is a cross-sectional view of FIG. 7 taken along lines 8—8.

FIG. 9 is a cross-sectional view of the part of the lead frame and diceafter encapsulation.

FIG. 10 is a cross-sectional view of part of the encapsulated lead frameand dice after the connecting sheet has been removed.

FIG. 11 is a cross-sectional view of a resulting chip scale IC package.

FIG. 12 is a top view of the lead frame, shown to accommodate differentsize dice.

FIG. 13 is a cross-sectional view of a part of a lead frame used inanother embodiment of the invention.

FIG. 14 is a top view of the part of the lead frame shown in FIG. 13.

FIG. 15 is a cross-sectional view of the part of the lead frame and diceafter encapsulation.

FIG. 16 is a cross-sectional view of part of a resulting IC package withleads.

FIG. 17 is a cross-sectional view of an alternative resulting leadlesschip scale IC package.

FIG. 18 is a cross-sectional view of a part of a lead frame used inanother embodiment of the invention.

FIG. 19 is a top view of the part of the lead frame shown in FIG. 18.

FIG. 20 is a cross-sectional view of the part of the lead frame and diceafter encapsulation.

FIG. 21 is a cross-sectional view of part of a resulting IC package.

FIG. 22 is a cross-sectional view of a part of a lead frame used inanother embodiment of the invention.

FIG. 23 is a top view of the part of the lead frame shown in FIG. 22.

FIG. 24 is a cross-sectional view of part of a resulting IC package.

FIG. 25 is a cross-sectional view of the part of a locking lead frameand dice after encapsulation.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will now be described in detail with reference toa few preferred embodiments thereof as illustrated in the accompanyingdrawings. In the following description, numerous specific details areset forth in order to provide a thorough understanding of the presentinvention. It will be apparent, however, to one skilled in the art, thatthe present invention may be practiced without some or all of thesespecific details. In other instances, well-known process steps and/orstructures have not been described in detail in order to notunnecessarily obscure the present invention.

To facilitate discussion, FIG. 3 is a flow chart of a method used in apreferred embodiment of the invention. FIG. 4 is a cross-sectional viewof part of a metal sheet 400 before processing. The metal sheet may haveflat side surfaces. The metal sheet 400 is preferably copper, howeverother metallic materials, such as Alloy 42, may be used instead. Themetal sheet 400 is processed so that the illustrated part of the metalsheet 400 forms part of a lead frame 500, which has the cross-sectionalview as shown in FIG. 5. FIG. 6 is a top view of the part of the leadframe 500 shown in FIG. 5. The processing of the metal sheet 400 may beperformed by stamping or etching or another type of forming step. Thelead frame 500 provides a plurality of posts 404. In this embodiment,the posts 404 all have the same square cross-section. In addition, theposts 404 are spaced apart to form a square array. The square array isformed by aligning posts vertically and horizontally in columns androws, so that the vertical spacing is equal to the horizontal spacing.As illustrated, in this embodiment a connecting sheet 408 extendsthrough the center of the lead frame 500 so that the connecting sheet408 extends through the centers of the posts 404. The connecting sheet408 is imperforate in that it extends between the posts 404 without anyapertures. Plating, such as silver plating, may be added to the leadframe 500 for wire bonding. Much of the packaging handling equipment isdesigned for handling lead frame strips, therefore the part of the leadframe shown may be a part of a lead frame strip. Alternatively, the partof the lead frame shown may be part of a square or rectangular panel.

A plurality of dice is then attached to the metal sheet (step 308). FIG.7 is a top view of the part of the lead frame 500 with a plurality ofdice 704 mounted thereon. An epoxy, tape, or other adhesive may be usedto mount the dice to the lead frame 500. FIG. 8 is a cross-section takenalong lines 8—8 of FIG. 7. The dice 704 are mounted on upper parts of afirst set of posts 708. Wire bonding 710 may be used to electricallyconnect the dice 704 to a second set of posts 712. The wire bonding 710may be created by gold ball bonding, which is known in the art. In thisembodiment, the posts in the first set of posts 708 have the same size,shape, and spacing as the posts in the second set of posts 712.

The dice 704 may then be encapsulated (step 312). Using conventionalmolding the lead frame 500 can be encapsulated by an encapsulationmaterial 904, as shown in FIG. 9. If a dispensing method is used, then adam may be placed around the lead frame 500. Since the connecting sheet408 is imperforate in that it extends between the posts without anyapertures, the connecting sheet prevents the encapsulation material fromflowing under the lead frame 500, thus keeping the encapsulationmaterial on one side of the lead frame 500. The encapsulation materialmay then be hardened and cured to form a cap. One cap may be used tocover the entire lead frame. In the alternative, several caps may beprovided at various parts of the lead frame.

The lead frame, dice 704, and encapsulation material 904 may be mountedon sticky tape and then placed on a vacuum chuck of sawing equipment,which is known in the art. The sawing equipment may be used for removingthe connecting sheet 408 (step 316). In such a removal process, thesawing equipment cuts through only the connecting sheet 408 between theplurality of posts 708, 712. The removal of the connecting sheet formsthe first set of posts 708 into a first set of lead fingers 1008 and thesecond set of posts 712 into a second set of lead fingers 1012, whichmay be electrically isolated from each other, as shown in FIG. 10. Sincethe IC packages have not been singulated, the frame is in one piece heldby the encapsulation material 904. This allows all IC packages to betested in panel form (step 320), which allows faster and easier testing.After testing, the saw equipment may then be used to singulate the leadframe 500, dice 704, and encapsulation material 904 into individual ICpackages (step 324). In such a singulation process, the sawing equipmentcuts through the encapsulation material 904. FIG. 11 is across-sectional view of a chip scale IC package 1104 after singulation.The first set of lead fingers 1008 may provide thermal contacts to thedie 704 to allow cooling or thermal regulation of the die 704. Thesecond set of lead fingers 1012 provides electrical contacts to do die704.

If panel testing is not desired, then the chip scale IC packages may besingulated before electrical testing. In such a case, singulation may beperformed during the step of removing the connection sheet. In otherembodiments, other methods besides using saw equipment, such as etchingor laser cutting, may be used to remove the connection sheet and/or forsingulation.

FIG. 12 is a top view of part of a lead frame 1204, which illustrateshow dice of different sizes and different input/output counts may beaccommodated. A first size die 1208 may extend across two posts 1244along a width and along a length. Twelve posts 1244 surrounding theperiphery of the first size die 1208 may be used for electricalcontacts, which may be made into leads. A second size die 1212 mayextend across three posts 1244 along a width and along a length. Sixteenposts 1244 surrounding the periphery of the second size die 1212 may beused for electrical contacts, which may be made into leads. A third sizedie 1216 may extend across four posts 1244 along a width and along alength. Twenty posts 1244 surrounding the periphery of the third sizedie 1216 may be used for electrical contacts, which may be made intoleads. A fourth size die 1220 may extend across five posts 1244 along awidth and along a length. Twenty-four posts 1244 surrounding theperiphery of the fourth size die 1220 may be used for electricalcontacts, which may be made into leads. Even larger dice extendingacross more contacts may also be used. Rectangular dice of differentsizes may also be accommodated by the lead frame. FIG. 12 illustratesthat providing a pattern of posts in a square array provides a universallead frame that may accommodate different size and shape dice. To bestuse the features of the lead frame, for rectangular dice, each diepreferably is physically mounted on at least two posts. For square dice,each die preferably is physically mounted on at least four posts. Ifmore contacts for higher pin counts are desired for a specified sizedie, a universal flame with a smaller pitch (distance between posts) maybe used. Although the lead frame is universal, not being made for onlyone die size, the dice may be placed close together in a compactarrangement to minimize lead frame area per die. The uniform distancebetween posts allows for the universal lead frame. A uniform distancebetween posts in both width and length to provide a square array allowsfor a more preferable universal lead frame.

In another embodiment of the invention, the metal may be processed ononly a single side to form a lead frame. FIG. 13 is a cross-sectionalview of part of a lead frame 1304 that has been etched on only one side.FIG. 14 is a top view of the part of the lead frame 1304 shown in FIG.13. The lead frame 1304 comprises a plurality of posts 1308 and aconnecting sheet 1312. In this embodiment, the connecting sheet 1312extends along the bottom of the posts 1308, instead of through thecenters of the posts as described in the previous embodiment. The leadframe 1304 may be formed by stamping, etching, or another type ofprocess. As shown in FIG. 14, the posts 1308 are all of the same sizeand are in a square array. Such a square array places the posts incolumns and rows where the columns are spaced evenly apart by a distanceequal to the distance between rows so that the pitch between the columnsequals the pitch between the rows.

As with the previous embodiment, dice 1504 may be mounted on a first setof posts 1508, as shown in FIG. 15. An epoxy may be used to mount thedice to the first set of posts 1508. Wire bonding 1512 may be used toelectrically connect the dice 1504 to a second set of posts 1516. Thewire bonding 1512 may be created by gold ball bonding, which is known inthe art. In this embodiment, the posts from the first set of posts 1508have the same size, shape, and spacing as the posts from the second setof posts 1516.

The dice 1504 may then be encapsulated. Using conventional molding, thelead frame 1304 can be encapsulated by encapsulation material 1520. If adispensing method is used, then a dam may be placed around the leadframe 1304. The connecting sheet 1312 helps to prevent the encapsulationmaterial from flowing under the lead frame 1304, thus keeping theencapsulation material on one side of the lead frame 1304. Theencapsulation material may then be hardened and cured to form a cap. Onecap may be used to cover the entire lead frame. In the alternative,several caps may be provided at various parts of the lead frame.

The lead frame, dice 1504, and encapsulation material 1520 may bemounted on sticky tape and then placed on a vacuum chuck of sawingequipment, which is known in the art. The sawing equipment may be usedfor removing the connecting sheet 1312. In such a removal process, thesawing equipment cuts through only the connecting sheet 1312 between theposts 1308. The removal of the connecting sheet forms the posts 1308into lead fingers 1604, which may be electrically isolated from eachother, as shown in FIG. 16. If the IC packages have not been singulated,the frame is in one piece held by the encapsulation material 1520, whichallows all IC packages to be tested in panel form. After testing, thesaw equipment may then be used to singulate the lead frame 1304, dice1504, and encapsulation material 1520 into individual IC packages 1608,as shown in FIG. 16. In such a singulation process, the sawing equipmentcuts through the encapsulation material 1520.

The use of a saw to separate the posts provides the lead fingers 1604 orpins. Such lead fingers or pins are preferable. In the alternative, theconnecting sheet may be thinned by etching, as described in U.S. patentapplication Ser. No. 09/528,540, entitled “Leadless Packaging ProcessUsing a Conductive Substrate”, by Bayan et al., filed Mar. 20, 2000, toprovide a leadless IC package 1704, as shown in FIG. 17.

Since the lead frame 1304 has the same square array as described in theprevious embodiment, the lead frame 1304 is a universal lead frame,which may accommodate dice of different sizes, as shown in FIG. 12.

In other embodiments, a universal lead frame with a square array ofposts may have the posts in the square array closer together (a smallerdistance and pitch between posts) to allow a higher number of contactposts for a particular die size. In another embodiment, a universal leadframe may have a rectangular array where the posts are arranged incolumns and rows where the distance between (pitch of) the rows isdifferent than the distance between the columns. Posts in otherembodiments may be rectangular or have some other cross-section insteadof having a square cross-section.

FIG. 18 is a cross-sectional view of part of a lead frame 1804 providedin another embodiment of the invention. FIG. 19 is a top view of thepart of the lead frame 1804. The lead frame 1804 comprises a pluralityof posts which comprise a set of die attach pad posts 1808 and a set ofconnector posts 1812. The die attach pad posts 1808 have a cross-sectionthat is several times wider than the cross-section of the connectorposts 1812. Each die attach pad post 1808 is generally surrounded byconnector posts 1812, with at least two rows of connector posts 1812between the die attach pad posts 1808. Generally, the connector posts1812 are formed in rows and columns. A connecting sheet 1816 extendsthrough the center of the lead frame 1804 so that the connecting sheet1816 extends through the centers of the die attach pad posts 1808 andconnector posts 1812.

Dice 2004 may be mounted on the die attach pad posts 1808, as shown inFIG. 20. An epoxy may be used to mount the dice 2004 to the die attachpad posts 1808. Wire bonding 2012 may be used to electrically connectthe dice 2004 to the connector posts 1812. The wire bonding 2012 may becreated by gold ball bonding, which is known in the art.

The dice 2004 may then be encapsulated. Using conventional molding, thelead frame 1804 can be encapsulated by encapsulation material 2016. If adispensing method is used, then a dam may be placed around the leadframe 1804. The connecting sheet 1816 helps to prevent the encapsulationmaterial from flowing under the lead frame 1804, thus keeping theencapsulation material on one side of the lead frame 1804. Theencapsulation material may then be hardened and cured to form a cap.

The lead frame, dice 2004, and encapsulation material 2016 may bemounted on sticky tape and then placed on a vacuum chuck of sawingequipment, which is known in the art. The sawing equipment may be usedfor removing the connecting sheet 1816. In such a removal process, thesawing equipment first cuts through only the connecting sheet 1816 toseparate the connector posts 1812 and die attach posts 1808. The removalof the connecting sheet forms the connector posts 1812 and die attachposts 1808 into lead fingers 2104, which may be electrically isolatedfrom each other, as shown in FIG. 21. Providing the die attach pad posts1808 and connector posts 1812 into rows and columns so that there arestraight paths of connecting sheet 1816 between the die attach pad posts1808 and connector posts 1812 may provide for easier sawing and removalof the connecting sheet 1816. If the IC packages have not beensingulated, the frame is in one piece held by the encapsulation material2016, which allows all IC packages to be tested in panel form. Aftertesting, the sawing equipment may then be used to singulate the leadframe 1804, dice 2004, and encapsulation material 2016 into individualIC packages 2108, as shown in FIG. 21. In such a singulation process,the sawing equipment cuts through the encapsulation material 2016.

In this embodiment, the lead frame is not universal, in that the dieattach pad posts tend to limit the size of the die to be approximatelyequal to the cross-section of the die attach pad post. In thisembodiment, the connecting sheet is used to prevent the encapsulatingmaterial from passing through the lead frame. In addition, the removalof the connecting sheet allows the formation of lead fingers.

In another embodiment of the invention, the metal sheet may be processedon only a single side to form a lead frame. FIG. 22 is a cross-sectionalview of part of a lead frame 2204 provided in another embodiment of theinvention. FIG. 23 is a top view of the part of the lead frame 2204. Thelead frame 2204 comprises a plurality of posts which comprise a set ofdie attach pad posts 2208 and a set of connector posts 2212. The dieattach pad posts 2208 have a cross-section that is several times widerthan the cross-section of the connector posts 2212. Each die attach padpost 2208 is generally surrounded by connector posts 2212, with at leasttwo rows of connector posts 2212 between the die attach pad posts 2208.Generally, the connector posts 2212 are formed in rows and columns. Aconnecting sheet 2216 extends along the bottom of the lead frame 2204 sothat the connecting sheet 2216 along the bottoms of the die attach padposts 2208 and connector posts 2212, instead of through the center asdisclosed in the previous embodiment.

As in the previous embodiments, dice 2404, as shown in FIG. 24, may beadhesively mounted to the die attach pad posts 2208. Wire bonds 2406 areused to electrically connect the connector posts 2212 to the dice 2404.Using conventional molding the dice 2404 and the lead frame 2204 may beencapsulated by an encapsulating material 2408. A saw may be used to cutaway the connecting sheet 2216 to form leads 2412 from the connectorposts 2212 and die attach posts 2208, and may be used to singulate thedice 2404 to form integrated packages 2416.

FIG. 25 is a cross-sectional view of part of a lead frame 2504 ofanother embodiment of the invention, which provides a plurality of posts2508 with sloped sides 2512. The lead frame 2504 comprises a pluralityof posts 2508 and a connecting sheet 2516. In this embodiment, theconnecting sheet 2516 extends along the bottom of the posts 2508, butmay extend through the centers of the posts. In this embodiment, thesloped sides 2512 of the plurality of posts 2508 may be formed by anetching process. Dice 2520 may be adhesively attached to some of theplurality of posts 2508. Wire bonds 2522 are used to electricallyconnect the dice 2520 to others of the plurality of posts 2508. Usingconventional molding the dice 2520 and parts of the lead frame 2504 maybe encapsulated by an encapsulating material 2524. The sloped sides 2512help to lock the encapsulating material 2524 onto the lead frame 2504.The sloped sides 2512 for locking the encapsulating material 2524 ontothe lead frame 2504 may take various forms. The sloped sides may be astraight slope, as shown in FIG. 25. The sloped sides may be curved. Themain requirement in this embodiment is that the sloped sides providelocking posts so that the encapsulating material is locked onto the leadframe. Locking posts may be provided when part of a post is wider at alocation than a part of the post lower down or that part of the gapbetween the posts is narrower at a location than a part of the gap lowerdown. The connecting sheet 2516 is removed and the IC packages aresingulated as described in the previous embodiments.

While this invention has been described in terms of several preferredembodiments, there are alterations, modifications, permutations, andsubstitute equivalents, which fall within the scope of this invention.It should also be noted that there are many alternative ways ofimplementing the methods and apparatuses of the present invention. It istherefore intended that the following appended claims be interpreted asincluding all such alterations, permutations, and substitute equivalentsas fall within the true spirit and scope of the present invention.

What is claimed is:
 1. An integrated circuit package, comprising: aplurality of leadframe posts, wherein each post has a first end and asecond end, and wherein the first end of each post has a diameter thatis larger than a diameter of the second end of each respective post; adie attach pad having a bottom surface that is substantially coplanarwith the second ends of each of the plurality of posts, wherein the dieattach pad and each of the posts have the same thickness; an integratedcircuit chip having a first surface that is secured to the die attachpad and a second surface that is opposite from the first surface; aplurality of conductive wires connected between the second surface ofthe integrated circuit chip and the first end of each of the posts; andan encapsulating material cap surrounding at least a portion of theintegrated circuit chip and at least a portion of the first ends of theplurality of posts such that the encapsulating material cap mechanicallysecures each of the plurality of posts in place, whereby the posts aresubstantially only held in place by the encapsulating material cap. 2.An integrated circuit package as recited in claim 1 wherein theintegrated circuit package has a top surface and side surfaces whereinthe top and side surfaces are perpendicular to each other.
 3. A packagedsemiconductor device comprising: a semiconductor die; a die attach padhaving a top and a bottom surface, the semiconductor die being attachedto the top surface of the die attach pad; a plurality of electricallyconductive leadframe posts that surround the die attach pad, each of theposts having a top and bottom surface wherein the top surfaces of theposts are wirebonded to the semiconductor die, and wherein the topsurface of each post has a diameter that is larger than a diameter ofthe bottom surface of each respective post, the bottom surfaces of thedie attach pad and the posts being substantially coplanar, wherein thedie attach pad and each of the posts have the same thickness; and amolding cap that encapsulates at least a portion of the semiconductordie, the die attach pad and the plurality of posts such that the moldingcap mechanically secures each of the plurality of posts, whereby theposts are substantially only held in place by the molding cap.
 4. Apackaged semiconductor device as recited in claim 3 wherein at least tworows of posts surround the die attach pad.
 5. A packaged semiconductordevice as recited in claim 3 wherein the packaged semiconductor devicehas a top surface and side surfaces wherein the top and side surfacesare perpendicular to each other.
 6. An integrated circuit package asrecited in claim 1 wherein each of the posts has a longitudinal axis andthe encapsulating material cap surrounds at least approximately one-halfof each post in the longitudinal direction.
 7. An integrated circuitpackage as recited in claim 3 wherein each of the posts has alongitudinal axis and the molding cap surrounds at least approximatelyone-half of each post in the longitudinal direction.
 8. An integratedcircuit package, comprising: a plurality of posts arranged in a uniformarray of rows and columns wherein each post has a top end and a bottomend, and wherein the top end of each post has a diameter that is largerthan a diameter of the bottom end of each respective post; an integratedcircuit chip having a top surface and a bottom surface that is oppositefrom the top surface wherein the bottom surface of the integratedcircuit chip is directly attached to at least some of the posts andwherein the top surface has a plurality of bonding pads; a plurality ofconductive wires connecting selected bonding pads with the top ends ofassociated posts; and an encapsulating material cap surrounding at leasta portion of the integrated circuit chip and at least a portion of thetop ends of the plurality of posts such that the encapsulating materialcap acting substantially alone physically secures each of the pluralityof posts that are not directly attached to the integrated circuit chipin place.
 9. An integrated circuit package as recited in claim 8 whereinthe encapsulating material cap has a bottom surface and wherein thebottom ends of the plurality of posts are exposed through the bottomsurface of the encapsulating material cap.
 10. An integrated circuitpackage as recited in claim 8 wherein the bottom ends of the posts aresubstantially coplanar with the bottom surface of the encapsulatingmaterial cap.
 11. An integrated circuit package as recited in claim 8wherein each of the posts has a longitudinal axis and the encapsulatingmaterial cap surrounds at least approximately one-half of each post inthe longitudinal direction.
 12. An integrated circuit package as recitedin claim 8 wherein each of the plurality of posts are leadframe posts.13. A universal leadframe, comprising: a connecting sheet having auniform two-dimensional array of electrically conductive posts arrangedin rows and columns, the posts extending from the connecting sheet, theconnecting sheet being suitably sized such that a plurality ofsemiconductor dice can be mounted onto at least some of the posts in atwo-dimensional array with posts being exposed between each of the dicesuch that each die may be wirebonded to associated posts, each of theelectrically conductive posts having a length that is substantiallyperpendicular to the connecting sheet, and wherein a first end of eachof the posts has a cross-sectional area that is larger than across-sectional area of each respective post near the region where eachrespective post is connected to the connecting sheet; and a plurality ofsemiconductor dice that are directly attached to respective postswherein the dice are arranged in a two-dimensional array with postsbeing exposed between each of the dice such that each die may bewirebonded to associated posts.
 14. A universal leadframe as recited inclaim 13 wherein the array of electrically conductive posts has at least30 rows and 50 columns.
 15. A universal leadframe as recited in claim 13wherein the electrically conductive posts extend from a first side ofthe connecting sheet, the leadframe further comprising: a protectivemolding panel formed on the first side of the connecting sheet such thatthe protective molding panel encapsulates the electrically conductiveposts.
 16. A universal leadframe as recited in claim 13 furthercomprising: a mold panel that encapsulates at least a portion of each ofthe posts and each of the plurality of semiconductor dice.
 17. Auniversal leadframe as recited in claim 13 wherein each semiconductordie has a top surface having a plurality of bonding pads, the bondingpads on each of the semiconductor dice are electrically connected toassociated posts via associated bonding wires.
 18. A universal leadframeas recited in claim 13 wherein each of the semiconductor dice aredirectly attached to at least four posts.
 19. A universal leadframe asrecited in claim 13 wherein each of the semiconductor dice are directlyattached to a number of posts in the range of nine to twenty-five.
 20. Auniversal leadframe as recited in claim 13 wherein at least a three bytwo array of semiconductor dice is mounted onto at least some of theposts.
 21. A universal leadframe as recited in claim 13 wherein at leasta five by five array of semiconductor dice is mounted onto at least someof the posts.